Die Inspection

         Visual Inspection - The Concept

    Due to the delicate nature of the product and the varied stresses endured
    during its fabrication, dicing, and arrival at its finished form, each individual
    chip requires a level of visual inspection to remove defective product. Flaws
    in the finished product usually originate at either the fabrication stage or are
    caused by physical mishandling during the separation process.


    Visual Inspection - The Process

    All product receives 2 inspections: the first inspection occurs after the
    product is placed in its end container where rejects are removed and
    replaced with acceptable product. The second inspection occurs as a final
    quality check, commonly known as final Q.C. This is performed by a senior
    member of staff with long term experience in all product types. This ensures
    our capability to meet the Delivery and Quality demands of our customers.


    Visual Inspection - Capability

    MIL STD 750 - for Transistors and Diodes
         MIL STD 883 - condition A or B for Integrated Circuits
  Customer Specifications


    Turn Key Solution

    Wafer Thinning
         Wafer Saw/Clean
Die Inspection
Drop shipment to the end customer
DIE INSPECTION