wherein the die is directly mounted to the board or substrate with die attach adhesive material and electrically interconnected to its circuit trace by using a traditional semiconductor wire bonding process, instead of undergoing traditional assembly or packaging as an individual IC. The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths. The die and bonded wires are encapsulated by encapsulant material such as transfer epoxy molding compound, plastic injection mold, liquid encapsulant or glob top material, to protect them from any damage that may be created by outside mechanical stress and/or environment." Source: www.SiliconFarEast.com CEI has been producing COB products since 1991 for any array of customers worldwide. Its applications are RFID, Watch modules, Smart cards, Toy, Automotive applications. We are also capable of designing and fabricating the injection tools for encapsulating the final products. |
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CHIP-ON-BOARD
